Modern semiconductor innovation faces several major barriers:
These challenges make advanced semiconductor development inaccessible for many organizations.
SpringMesh focuses on creating practical pathways that allow:
to participate more effectively in semiconductor innovation.
SpringMesh is a collaborative semiconductor enablement platform designed to support the journey from:
The initiative combines:
to help reduce the barriers associated with semiconductor development.
Supporting semiconductor education, research, and practical silicon experimentation.
Helping emerging companies validate ideas before large manufacturing investment.
Providing pathways toward practical ASIC and SoC realization.
Supporting organizations developing regional semiconductor capabilities.
ASEAN’s semiconductor future cannot depend only on manufacturing assembly capacity.
Long-term growth also requires:
SpringMesh aims to contribute toward this long-term infrastructure foundation.
Area | Focus |
|---|---|
MPW Preparation | Design readiness and prototyping |
ASIC Pathways | Transition toward silicon realization |
University Programs | Semiconductor education support |
Startup Enablement | Lower-cost innovation pathways |
Ecosystem Collaboration | Shared infrastructure and partnerships |
SpringMesh is based on a simple belief:
Semiconductor innovation should not be limited only to organizations with billion-dollar infrastructure.
The future semiconductor industry will increasingly depend on:
SpringMesh was created to help support that transition.
Spring Semiconductor views SpringMesh as part of a broader effort to help establish stronger semiconductor ecosystems across ASEAN.
The long-term goal is to help create:
This supports a future where more organizations can participate in semiconductor innovation, experimentation, and advanced hardware development.
SpringMesh represents Spring Semiconductor’s vision for more accessible, collaborative, and scalable semiconductor infrastructure across ASEAN.
SpringMesh provides a complete Multi-Project Wafer (MPW) ecosystem, enabling designers, startups, universities, and research teams to bring silicon ideas to life efficiently. By pooling multiple designs onto shared wafers, SpringMesh reduces the cost of tape-out while maintaining flexibility and speed for prototyping and small-volume production.
Foundry Collaborations & Node Coverage
SpringMesh works closely with leading foundries to offer a broad spectrum of process nodes:
Silterra, X-FAB and SkyWater — covering specialty, analog/mixed-signal, and digital processes. Node options span 0.18µm to 65nm, ensuring projects can match design complexity, cost, and performance requirements.
Access to TSMC’s VCA (Value Chain Aggregator) Program provides an accelerated path for select projects on advanced nodes.
MPW Services & Partnerships
Spring is a reseller and facilitator for platforms like ChipFoundry and TinyTapeout, giving designers global MPW access while keeping local support and guidance.
This allows teams to focus on design innovation without worrying about logistics or wafer coordination.
SpringMesh provides turnkey support from project submission to wafer delivery, enabling fast and reliable first-silicon experience.
Malaysia’s semiconductor journey takes a decisive leap forward through a strategic partnership with TOPPAN Technical Design Center, establishing the nation’s first true one-stop gateway for IC manufacturing. From concept to silicon, Malaysian companies, universities, and innovators can now access a unified platform that connects design, prototyping, wafer fabrication, packaging, and testing. The platform begins with MPW (Multi-Project Wafer) access for cost-effective prototyping, before scaling seamlessly into MP (Mass Production) for full commercial deployment. Through TOPPAN’s global ecosystem, this gateway enables streamlined access to leading foundries such as TSMC, Samsung Electronics, GlobalFoundries, UMC, and SMIC, alongside specialty and analog leaders including Tower Semiconductor, XFAB, Vanguard International Semiconductor, and DB HiTek.
Beyond advanced logic, the platform unlocks critical entry into the growing power semiconductor domain, connecting Malaysia to partners such as Phenitec Semiconductor, Vanguard International Semiconductor, and DB HiTek, supported by TOPPAN’s deep manufacturing network in Japan and across Asia. Anchored locally by Spring Semiconductor, this initiative removes traditional barriers of scale, cost, and access, enabling startups, SMEs, and research institutions to participate in global chip production with speed and confidence. In essence, Malaysia evolves from a participant into a gateway nation, where ideas are no longer constrained by access but accelerated by a fully integrated semiconductor ecosystem.
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