‌SpringBlades
Malaysia’s First Prototyping System for SoC Innovation

A New Frontier

Malaysia’s aspiration to become a regional semiconductor powerhouse hinges on more than factories and funding—it demands mastery of chip design. To achieve this, Spring Semiconductor (SpringSemi) and CEDEC Malaysia have co-developed SpringBlade, the nation’s first SoC prototyping platform, tailored for education, research, and industry acceleration.

SpringBlade is a strategic milestone aligned with the National Semiconductor Strategy (NSS), designed to empower Malaysia’s IC designers, train the next generation of engineers, and prototype world-class silicon systems—from RTL to TSMC tapeout—right here at home.

 

SpringBlade+


Springblade+ is our inaugural product in this family—built on the robust Xilinx VU13P  platform. It marked our first step into merging high-density programmable logic with  embedded processing via an add-on ARM Cortex-A53 module. Designed for mid-range  complexity, it enabled startups, research teams, and AI developers to rapidly prototype and  verify system designs.

HaaS – Hardware-as-a-Service

Springblade platforms come with integrated remote access through our HaaS Portal, enabling:

  • Full remote board access (power, JTAG, UART, data transfer)
  • Web-based interface for prototyping anywhere in the world
  • Multi-user time slot management for project teams
  • Secure access with role-based permissions

Perfect for:

  • Distributed development teams
  • University programs
Commercial IP validation labs

Modular Ecosystem (30+ Modules Available)

Each Springblade system is compatible with a library of over 50 development modules:

  • Image Processing: HDMI, MIPI CSI/DSI, DisplayPort, ISP pipelines
  • Storage: NVMe, SATA, SD Card, DDR4 banks, eMMC
  • I/O Expansion: GPIO, LVDS, PMOD, FMC+, high-speed serial

All modules are hot-pluggable, reconfigurable, and supported by a unified SDK.